ptctz www.vishay.com vishay bccomponents revision: 27-nov-15 1 document number: 29068 for technical questions, contact: nlr@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 smd ptc thermistors for overload protection note (1) customized products are available on request in the indicated nominal r 25 range. larger 8 mm ceramics for lower resistance values or higher voltages are in use in the ptccz08 series. features ? compact resettable overload protection ? low mounting height ? suitable for reflow soldering ? small ceramic diameter for faster response ? low heat transfer to substrate ? flat terminations for stable positioning and good solderability ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 applications over-temperature/over-load protection: ? telecom -central office switching (c.o.) -subscriber terminal equipment (t.e.) -set-top box -modems ? general industry and automotive -low power overload protection -inrush current limitation description the component consists of a high performance ptc ceramic mounted in a lead frame with lead (pb)-free tin plated contacts. the terminations are joined to the ag plated ceramic by a high melting solder. the ceramic is covered with a protective high te mperature silicone layer. marking ? all smd ptcs are marked with a 3-digit type number (xxx) and a date code (yyww) note (2) these types pass itu-k20- 21-45 telecommunication pr otection recommendation quick reference data parameter value unit standard types (1) telecom types (1) resistance value at 25 c 2 to 500 10 to 70 tolerance on r 25 value 10; 15; 20 % maximum overload current i ol (v max. dependent) 2 to 10 a maximum holding current (i nt ) 50 to?500 (at 25 c) 50 to?100 (at 70 c) maximum voltage (rms or dc) 16 to?400 220 to 600 v rms maximum trip time at 1 a 0.8 to 6 s switching temperature (t sw ) 105 to 140 c operating temperature range at max. voltage -40 to 85 storage temperature -40 to 155 maximum continuous power at 25 c 2w electrical data and ordering information resistance matching ( ) v max. (v) i nt at i t at max. trip-time at 1 a (s) max. i ol at v max. (a) t sw operating temp. range at max. voltage storage temp. range catalog number r 25 ( ) tol. (%) 25 c (ma) 70 c (ma) 25 c (ma) sap ordering code type nr marking telecom and industrial types 10 20 - 245 165 100 270 3.0 2.0 105 0 to 70 -25 to 125 ptctz3nr100gtt (2) 012 10 20 0.5? 245 165 100 270 3.0 2.0 105 0 to 70 -25 to 125 ptctz3mr100gtt (2) 016 40 25 no 265 80 50 130 0.8 2.0 105 0 to 70 -25 to 125 ptctz3nr400htt 002 25 20 1? 265 120 70 220 1.3 2.0 110 0 to 70 -25 to 125 ptctz3mr250htt (2) 005 15?to?20 - - 300 150 100 250 1.5 1.5 115 0 to 70 -25 to 125 ptctz3nr150ktt (2) 004 15?to?20 - 0.5? 300 150 100 250 1.5 2.0 115 0 to 70 -25 to 125 ptctz3mr150ktt (2) 003 20 20 0.5? 300 120 70 250 1.4 1.5 105 0 to 70 -25 to 125 PTCTZ3MR200KTT (2) 018 35 +15 / -20 1? 425 110 70 175 1.0 0.7 125 -25 to 85 -40 to 155 ptctz3mr350mtt (2) 009 50 20 1? 425 90 60 150 0.8 0.7 125 -40 to 70 -40 to 125 ptctz3mr500mtt 019 general industrial types 3.3 25 - 24 400 - 650 6.0 8.0 140 -40 to 85 -40 to 155 ptctz3nr339ctt 013 9.4 25 - 60 150 100 300 1.8 3.0 115 -40 to 85 -40 to 155 ptctz3nr949ett 011
ptctz www.vishay.com vishay bccomponents revision: 27-nov-15 2 document number: 29068 for technical questions, contact: nlr@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ptc outlines dimensions in millimeters dimensions of solder lands in millimeters soldering conditions this smd thermistor is only suitable for reflow soldering, in accordance wi th jedec j-std-020d . soldering processes which can be used are reflow (i nfrared and convection heating) and vapor phase. the maximum temperature of 260 c during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. typical examples of a soldering processes that will pr ovide reliable joints withou t damage, are shown below. mounting conditions a flat pick-up area of minimum 10 mm 2 and low weight allows for fast placement. because of the nature of ptc ceramic ma terial the component should not be touc hed with bare hand s, as the residue of perspiration can infl uence component behavior at high temperatures. handling forces applied to th e component should be limited to 5 n in any condition. ptc smd cerami c size: 6.5 mm 3.6 0.1 10 0.25 8.0 2.8 2 4 0.1 4 0.2 0.2 10 max. 1 7.6 0.25 3.45 0.15 1.2 7.3 0 - 0.2 0.6 + 0.6 0 3 2 2 3 1 11 5 2 packaging type quantity carrier tape width pitch reel diameter ptctz 1500 ps conductive blister tape acc. iec60286-3 16 mm 12 mm 330 mm material information ref. description material and remarks 1 ceramic batio 3 doped 2 metalization nicr ag layer (vacuum deposition) 3 lead frame ni plated phosphor bronze material covered by matte tin layer 0 50 100 150 200 250 300 250 200 150 100 50 0 t (s) 215 c 180 c 20 s to 40 s internal preheating, e.g. by infrared, max. 2 k/s 100 c 130 c external preheating forced cooling t (c) typical values (solid line) process limits (dotted lines) vapor phase soldering reflow soldering 0 50 100 150 200 250 300 250 200 150 100 50 0 10 s 260 c t (s) 215 c 180 c 10 s 40 s 2 k/s t (c) 245 c 130 c typical values (solid line) process limits (dotted lines)
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